August 28, 2008

BGA Socket accommodates devices up to 6.5 mm². (ThomasNet)

Suited for use with test and burn-in of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices, CSP/MicroBGA Test and Burn-In Socket accommodates up to 500,000 cycles and operates from -67 to 302°F. It offers solderless pressure mount compression spring probes which allow sockets to be mounted to and removed from burn-in-board (BIB). Unit also features pressure pad compression spring that …

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